16 stories
See how Amperesand’s solid-state transformers aim to tame AI data center power spikes with batteries, 800 VDC conversion, and microgrid control. The post Amperesand Aims to Smooth AI Data Center Power Spikes appeared first on EE Times.
CASPA’s annual conference celebrates its 35th anniversary with a lineup of more than 35 CEOs from Silicon Valley, including Intel’s Lip-Bu Tan and Cerebras’s Andrew Feldman. The post CASPA CEO Summit Preview with President Jimmy Cheng appeared first on EE Times.
Applied Materials’ $5 billion EPIC Center brings chipmakers, equipment suppliers, and researchers together to accelerate semiconductor R&D and commercialization. The post Applied Materials Bets $5B on a New Model for Chip Innovation appeared first on EE Times.
GlobalFoundries said strained-silicon FD-SOI can deliver 7-nm-class performance without EUV and open a new market for Europe. The post Manfred Horstmann: GlobalFoundries Bets on FDX Fusion for Physical AI appeared first on EE Times.
Custom silicon lets AI data centers cut power, latency and data movement while improving economics at scale. The post Why Custom Silicon Matters in AI Data Centers appeared first on EE Times.
See how Synopsys uses agentic AI to orchestrate trusted EDA tools for precise, explainable chip design, and faster engineering workflows. The post Can AI Be Trusted? Synopsys on Agentic AI and Autonomous Engineering appeared first on EE Times.
Gopi Sirineni says AI’s bottleneck is power, not chips, and autonomous rack controllers can boost efficiency up to 30%. The post Why AI’s Limit Is Power, Not Chips: Gopi Sirineni at AI Infra Summit 2026 appeared first on EE Times.
For AMD CTO Mark Papermaster, tailored computing and holistic design are key to delivering AI. The post AMD’s Mark Papermaster: Exclusive Video Interview at World Summit AI appeared first on EE Times.
Track energized compute, not gigawatts, as AI data centers face delays in memory, networking, cooling, and power. The post The AI Boom Has a Gigawatt Accounting Problem appeared first on EE Times.
Axelera’s Europa brings 629 TOPS inference to 35W edge systems while Voyager cuts toolchain lock-in. The post Axelera AI: Data Center Inference Performance in the Power Envelope of Embedded Systems appeared first on EE Times.
Kepler targets 2027 production for 3D ferroelectric memory promising 5–10× better bandwidth per watt than HBM. The post Kepler Aims to Launch Energy-Saving Replacement for HBM in 2027 appeared first on EE Times.
See how trusted AI combines intelligence, domain expertise, and deterministic verification to boost confidence in semiconductor design. The post Trusted AI: Why Intelligence Alone Isn’t Enough appeared first on EE Times.
Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs. The post Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026 appeared first on EE Times.
See how Emergence AI is deploying neuroformal AI with chipmakers to boost wafer yields and tackle fab, test, and packaging failures. The post Emergence AI to Deploy Neuroformal AI With Fabless Chipmakers appeared first on EE Times.
Astera Labs pairs Leo memory controllers with Scorpio fabric switches to bring scalable memory closer to AI accelerators. The post Astera Labs’ Leo Controller Update Targets Memory Constraints appeared first on EE Times.
AI is transforming data centers into infrastructure platforms where power, cooling, and semiconductors determine scalability. The post AI Data Centers Make Power, Cooling Critical to Scaling appeared first on EE Times.
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