Asia Watch

2 stories

Stories

AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers
At A*STAR’s Innovate Together 2026, industry experts explored packaging, hybrid bonding, optical interconnects, and process control for AI. The post AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers appeared first on EE Times.
EE TimesSep 30, 20265 min read
Huawei’s Tau Law Takes Commercial Form
Kirin 9050 Pro rests on the Tau (τ) Scaling Law, marking a major change in chip architecture designed to bypass EUV lithography limits. The post Huawei’s Tau Law Takes Commercial Form appeared first on EE Times.
EE TimesSep 25, 20266 min read

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