14 stories
Benchmark Electronics combines engineering expertise, workforce development, and flexible production to expand high-mix electronics manufacturing across Thailand. The post Benchmark Electronics’ Thailand Operations Focus on High-Mix Manufacturing appeared first on EE Times.
At Ayar Labs CPO Summit, Meta, Broadcom, AMD, and others weighed in on readiness for a 2028 co-packaged optics demand surge and the OCI MSA’s role. The post Co-Packaged Optics Moves from Promise to Production Planning appeared first on EE Times.
Discover how Taiwan Innotech Expo 2026 showcased AI solutions designed to advance industries with practical, real-world impact The post TIE Showcases Taiwan’s Push to Deploy AI Across Industries appeared first on EE Times.
Honya Europe's Robert Tarantowicz shares 17 years of lessons on PCB sourcing in China, quality, trust, and risk management. The post 17 Years with China: What Really Makes a Partnership Work appeared first on EE Times.
Join this webinar and learn how to add LCD graphics to MCU projects without a display controller, accelerator, or external DRAM. The post Embedded Graphics on an MCU – Without an Accelerator appeared first on EE Times.
Consumer, industrial, networking, semiconductor, and software manufacturers face a broad product-cybersecurity regulation for the first time. The post EU CRA Readiness: 5 Steps Manufacturers Need to Take Now appeared first on EE Times.
Join this BitCast and explore how extending NoC connectivity across die boundaries enables engineering teams to scale from monolithic SoCs to multi-die architectures. The post Connecting Chiplets Isn’t Enough – Solving the Data Movement Challenge in Multi-Die Systems appeared first on EE Times.
Register now for our webinar to discover how Navitas 2.0 is revolutionizing AI infrastructure power delivery. The post Breaking the AI Infrastructure Power Wall: From Grid to xPU appeared first on EE Times.
Join this session where our expert will examine key power technologies, design considerations, and best practices that help manufacturers enhance product quality, accelerate qualification, and reduce risk.
Axelera’s Europa brings 629 TOPS inference to 35W edge systems while Voyager cuts toolchain lock-in. The post Axelera AI: Data Center Inference Performance in the Power Envelope of Embedded Systems appeared first on EE Times.
See how trusted AI combines intelligence, domain expertise, and deterministic verification to boost confidence in semiconductor design. The post Trusted AI: Why Intelligence Alone Isn’t Enough appeared first on EE Times.
Join us where attendees will see how on-device processing improves resilience, reduces exposure of sensitive data, counters spoofing, and supports practical deployment across buildings, smart locks, vehicles and appliances.
Are you struggling with PCBA defects? Learn how to optimize your PCBA testing strategy by combining In-Circuit Testing (ICT), Functional Testing (FCT with Bed-of-Nails or Flying Probe Testers. The post PCBA Test Strategies: How to Select the Right Methodology and Tester appeared first on EE Times.
Manufacturing intelligence connects EDA, TCAD and metrology to turn manufacturing evidence into trusted action, faster. The post Manufacturing Intelligence: Turning EDA Data into Trusted Action appeared first on EE Times.
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