25 stories
Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs. The post Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026 appeared first on EE Times.
Join us where attendees will see how on-device processing improves resilience, reduces exposure of sensitive data, counters spoofing, and supports practical deployment across buildings, smart locks, vehicles and appliances.
Are you struggling with PCBA defects? Learn how to optimize your PCBA testing strategy by combining In-Circuit Testing (ICT), Functional Testing (FCT with Bed-of-Nails or Flying Probe Testers. The post PCBA Test Strategies: How to Select the Right Methodology and Tester appeared first on EE Times.
Instead of traditional ERP, small electronics manufacturers are finding that affordable SME-focused manufacturing software provides needed functionality. The post Small Electronics Manufacturers Save Big on ERP appeared first on EE Times.
TSMC’s 3-nm node nears the revenue lead, but history shows 7 nm ramped faster; compare the data before evaluating 2 nm. The post TSMC’s 3-nm Ramp Looks Different in Historical Context appeared first on EE Times.
Manufacturing intelligence connects EDA, TCAD and metrology to turn manufacturing evidence into trusted action, faster. The post Manufacturing Intelligence: Turning EDA Data into Trusted Action appeared first on EE Times.
AI is transforming data centers into infrastructure platforms where power, cooling, and semiconductors determine scalability. The post AI Data Centers Make Power, Cooling Critical to Scaling appeared first on EE Times.
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