Once in decline, Japan's hard-drive suppliers ride soaring AI demand
TOKYO -- Japanese companies are racing to expand production of parts for hard-disk drives as the explosive spread of artificial intelligence drives de
Nikkei Asia Tech1 min read
electronics
52 stories
Three fourths of electronics firms in Malaysia to lift investment: AmCham
KUALA LUMPUR -- Nearly three-quarters of U.S. and local electronics companies operating in Malaysia plan to increase investment in the country, a surv
Nikkei Asia Tech1 min read
Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026
Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs. The post Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026 appeared first on EE Times.
EE Times2 min read
Edge Computing and Security for Access Control Applications: Getting the Best of the Two Worlds
Join us where attendees will see how on-device processing improves resilience, reduces exposure of sensitive data, counters spoofing, and supports practical deployment across buildings, smart locks, vehicles and appliances.
EE Times1 min read
PCBA Test Strategies: How to Select the Right Methodology and Tester
Are you struggling with PCBA defects? Learn how to optimize your PCBA testing strategy by combining In-Circuit Testing (ICT), Functional Testing (FCT with Bed-of-Nails or Flying Probe Testers. The post PCBA Test Strategies: How to Select the Right Methodology and Tester appeared first on EE Times.
EE Times5 min read
Small Electronics Manufacturers Save Big on ERP
Instead of traditional ERP, small electronics manufacturers are finding that affordable SME-focused manufacturing software provides needed functionality. The post Small Electronics Manufacturers Save Big on ERP appeared first on EE Times.
EE Times5 min read
Emergence AI to Deploy Neuroformal AI With Fabless Chipmakers
See how Emergence AI is deploying neuroformal AI with chipmakers to boost wafer yields and tackle fab, test, and packaging failures. The post Emergence AI to Deploy Neuroformal AI With Fabless Chipmakers appeared first on EE Times.
EE Times6 min read
TSMC’s 3-nm Ramp Looks Different in Historical Context
TSMC’s 3-nm node nears the revenue lead, but history shows 7 nm ramped faster; compare the data before evaluating 2 nm. The post TSMC’s 3-nm Ramp Looks Different in Historical Context appeared first on EE Times.
EE Times3 min read
Advanced Strategies for Heat Exchanger Manufacturing in EVs & Thermal Management Systems
Join us to explore how Praziflux® is transforming brazing processes across the EV industry and other thermal management applications. The post Advanced Strategies for Heat Exchanger Manufacturing in EVs & Thermal Management Systems appeared first on EE Times.
EE Times2 min read
Manufacturing Intelligence: Turning EDA Data into Trusted Action
Manufacturing intelligence connects EDA, TCAD and metrology to turn manufacturing evidence into trusted action, faster. The post Manufacturing Intelligence: Turning EDA Data into Trusted Action appeared first on EE Times.
EE Times5 min read
Astera Labs’ Leo Controller Update Targets Memory Constraints
Astera Labs pairs Leo memory controllers with Scorpio fabric switches to bring scalable memory closer to AI accelerators. The post Astera Labs’ Leo Controller Update Targets Memory Constraints appeared first on EE Times.
EE Times5 min read
Japan's TDK, Taiyo Yuden ally on next-generation AI components
TOKYO -- TDK and Taiyo Yuden have agreed to work together on developing next-generation electronic components for use with artificial intelligence, th
Nikkei Asia Tech1 min read
AI Data Centers Make Power, Cooling Critical to Scaling
AI is transforming data centers into infrastructure platforms where power, cooling, and semiconductors determine scalability. The post AI Data Centers Make Power, Cooling Critical to Scaling appeared first on EE Times.
EE Times4 min read
EU Cyber Resilience Act: Three Misconceptions That Put Embedded Products at Risk
The EU Cyber Resilience Act affects more embedded products than manufacturers may expect, with implications for connectivity, resale, and long-term security support. The post EU Cyber Resilience Act: Three Misconceptions That Put Embedded Products at Risk appeared first on EE Times.
EE Times5 min read
Why U.S.-Europe Cooperation Matters for Quantum Leadership
U.S.-Europe collaboration is critical for global quantum leadership, combining capital and talent to scale against rising competition. The post Why U.S.-Europe Cooperation Matters for Quantum Leadership appeared first on EE Times.
EE Times5 min read
Full-Stack Semiconductor Solutions for Smart, Secure Industry and Digital Energy
NSING Technologies, a Singapore-founded semiconductor company, delivers full-stack chip solutions for industrial automation, AI data centers, and digital energy.The N32-series MCUs (144–600 MHz, Cortex-M4F/M7) integrate EtherCAT, CAN-FD, USB-HS, and high-precision ADCs, powering servo drives,…
EE Times1 min read
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