72 stories
Intel was the first large chipmaker to start using advanced packaging methods in 2017 – 2019. But where are Intel's EMIB and Foveros technologies today and where are they heading?
Elon Musk may prefer FEL light sources for in-house chip production, but Terafab will start with proven tech from ASML.
See how Amperesand’s solid-state transformers aim to tame AI data center power spikes with batteries, 800 VDC conversion, and microgrid control. The post Amperesand Aims to Smooth AI Data Center Power Spikes appeared first on EE Times.
CASPA’s annual conference celebrates its 35th anniversary with a lineup of more than 35 CEOs from Silicon Valley, including Intel’s Lip-Bu Tan and Cerebras’s Andrew Feldman. The post CASPA CEO Summit Preview with President Jimmy Cheng appeared first on EE Times.
Amazon is in talks to buy the AI startup Decart in a deal that could value it at about $7bn, The Wall Street Journal reported on Sunday. Kate Clark and Lauren Thomas reported the talks, citing people familiar with the matter.
Low-volume production sits between research and mass manufacturing. Europe needs an industrial model to fill the gap. The post Europe’s Advanced Packaging Gap: Fraunhofer, Swissbit Target the Missing Middle appeared first on EE Times.
Applied Materials’ $5 billion EPIC Center brings chipmakers, equipment suppliers, and researchers together to accelerate semiconductor R&D and commercialization. The post Applied Materials Bets $5B on a New Model for Chip Innovation appeared first on EE Times.
GlobalFoundries returns to advanced FD-SOI development with 7nm-class FDX Fusion process — production planned for 2028.
Europe’s CRA turns chip security into auditable sign-off, pushing silicon teams to prove resilience before 2027. The post Security Becomes a Sign-off Item appeared first on EE Times.
Japanese semiconductor materials giant Sumitomo Bakelite plans to expand production of advanced chip packaging materials in China and Singapore, marking the second such announcement for its Chinese operations in less than four months as artificial intelligence drives demand for more sophisticated…
Penang is already described as the “Silicon Valley of the East” and a global hub for electronics and semiconductors.
NVIDIA said on October 8, 2026, that it will commit $1 billion over five years to U.S. research in super intelligence for science and quantum computing.
Custom silicon lets AI data centers cut power, latency and data movement while improving economics at scale. The post Why Custom Silicon Matters in AI Data Centers appeared first on EE Times.
GlobalFoundries becomes a part of TSMC's CoWoS supply chain in the U.S.: set to participate in production of leading-edge AI and HPC accelerators without investing in leading-edge process technologies.
Wolfspeed has secured a conditional $1.5 billion, 30-year loan commitment from the U.S. Department of War to expand GaN epitaxy and radiation-hardened SiC and GaN technologies for U.S. national security applications
Rising semiconductor costs and computing requirements drive automakers toward modular ADAS AI solutions. The post Rising Costs, Compute Demand Push ADAS Toward Modular AI appeared first on EE Times.
AMD is pursuing a 'broader partnership' with Samsung as memory company wants to tie advanced memory supply to its orders at its foundry unit.
AI demand fattens chipmakers' margins while cheaper PCs and phones become harder to produce profitably
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