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AI is transforming data centers into infrastructure platforms where power, cooling, and semiconductors determine scalability. The post AI Data Centers Make Power, Cooling Critical to Scaling appeared first on EE Times.
The EU Cyber Resilience Act affects more embedded products than manufacturers may expect, with implications for connectivity, resale, and long-term security support. The post EU Cyber Resilience Act: Three Misconceptions That Put Embedded Products at Risk appeared first on EE Times.
At SEMICON India 2026, IBM's Rahul Rao details India's role in quantum scaling, Qiskit education, and AI accelerators. The post IBM Details Quantum, AI Developments in India appeared first on EE Times.
U.S.-Europe collaboration is critical for global quantum leadership, combining capital and talent to scale against rising competition. The post Why U.S.-Europe Cooperation Matters for Quantum Leadership appeared first on EE Times.
Calterah brings UWB keyless anchors into synchronized networks, delivering enhanced vehicle safety without adding expensive hardware. The post Calterah Turns UWB Digital Keys into In-Cabin Sensors appeared first on EE Times.
Xcena’s MX1 uses CXL to push compute into memory by combining DDR5, SSDs, and RISC-V cores while easing programmability. The post Xcena Cuts Data Movement to Address Memory Bottlenecks appeared first on EE Times.
NSING Technologies, a Singapore-founded semiconductor company, delivers full-stack chip solutions for industrial automation, AI data centers, and digital energy.The N32-series MCUs (144–600 MHz, Cortex-M4F/M7) integrate EtherCAT, CAN-FD, USB-HS, and high-precision ADCs, powering servo drives,…
Kirin 9050 Pro rests on the Tau (τ) Scaling Law, marking a major change in chip architecture designed to bypass EUV lithography limits. The post Huawei’s Tau Law Takes Commercial Form appeared first on EE Times.
As edge AI transforms smart buildings, Wi-Fi HaLow bridges the gap between bandwidth, long range, and low power. The post Balancing Bandwidth, Range, and Power in Intelligent Buildings appeared first on EE Times.
Delos’s Apollo chiplet is designed to bridge different endpoint semantics and interconnects, creating a low-latency domain spanning GPUs, accelerators, CPUs and memory The post Delos Data Targets Heterogeneous AI with Data Interface appeared first on EE Times.
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