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AI data centers have spent heavily on faster accelerators, denser racks and liquid cooling to keep that hardware running. The data pipeline that feeds those processors has not kept up, and expensive compute ends up waiting on memory and storage.
ASM International shows how building increasingly complex 3D devices requires advances in materials and processes. The post Beyond Lithography: 3D Scaling Puts New Demands on Materials appeared first on EE Times.
Data sovereignty is becoming an architectural problem as enterprises push artificial intelligence inference toward their most sensitive information. Pipelines assembled from separate tools struggle to keep embeddings, permissions and source data aligned, leaving many valuable data sets out of AI’s…
AI factories run on graphics processing units that cost a fortune and work at blistering speed, yet those chips increasingly sit idle waiting for data. As the bottleneck moves from compute to memory and storage, NAND flash is being asked to do far more than hold files.
AI infrastructure networking is approaching a physical turning point as the copper links that tie GPUs together inside a rack strain under ever-faster signaling speeds. The move to light-based interconnects could redraw the boundaries of what counts as a single AI system. Cisco Systems Inc.
Applied Materials’ $5 billion EPIC Center brings chipmakers, equipment suppliers, and researchers together to accelerate semiconductor R&D and commercialization. The post Applied Materials Bets $5B on a New Model for Chip Innovation appeared first on EE Times.
The artificial intelligence infrastructure race is no longer just about building faster chips. AI infrastructure bottlenecks are shifting attention to a bigger challenge: keeping those chips supplied with data, connected through high-speed networks and operating within increasingly demanding power…
Custom silicon lets AI data centers cut power, latency and data movement while improving economics at scale. The post Why Custom Silicon Matters in AI Data Centers appeared first on EE Times.
For AMD CTO Mark Papermaster, tailored computing and holistic design are key to delivering AI. The post AMD’s Mark Papermaster: Exclusive Video Interview at World Summit AI appeared first on EE Times.
TSMC’s 3-nm node nears the revenue lead, but history shows 7 nm ramped faster; compare the data before evaluating 2 nm. The post TSMC’s 3-nm Ramp Looks Different in Historical Context appeared first on EE Times.
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