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3D chips7 min read

Beyond Lithography: 3D Scaling Puts New Demands on Materials

ASM International shows how building increasingly complex 3D devices requires advances in materials and processes. The post Beyond Lithography: 3D Scaling Puts New Demands on Materials appeared first on EE Times.

By Pat BransEE Times
Beyond Lithography: 3D Scaling Puts New Demands on Materials

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Originally published by EE Times on Oct 14, 2026.

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