Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing
Rohm Semiconductor retains wafer fabrication in-house as it expands its back-end semiconductor operations and R&D footprint in India. The post Rohm Semiconductor Expands Back-End Chip Manufacturing Outsourcing appeared first on EE Times.
Rohm Semiconductor is expanding its back-end chip manufacturing outsourcing in India, partnering with Tata Electronics and Suchi Semicon for assembly and test operations while maintaining in-house wafer fabrication.
What happened
Rohm Semiconductor is expanding its use of outsourced semiconductor assembly and test (OSAT) facilities in India, partnering with Tata Electronics and Suchi Semicon for different packaging types. The company is maintaining in-house wafer fabrication and is evaluating the capabilities of Indian OSATs for potential expansion to global markets.
Why it matters
This development highlights Rohm's strategic shift towards outsourcing back-end processes to optimize costs and leverage local manufacturing capabilities. It also underscores the growing importance of India in the global semiconductor supply chain and the company's commitment to localizing production to meet regional and global demands.
- Rohm is outsourcing back-end processes in India to optimize costs and leverage local expertise.
- The company is maintaining in-house wafer fabrication while expanding OSAT partnerships.
- India's localization initiatives and supply chain resilience are key drivers for Rohm's strategy.
- Solist-AI and GaN technologies are part of Rohm's broader innovation efforts.
- The move could position India as a significant player in the global semiconductor manufacturing landscape.
The bigger picture
Rohm's expansion in India could enhance supply chain resilience and support the country's localization goals. The partnerships with Tata and Suchi Semicon may lead to increased production efficiency and access to local markets, potentially influencing global semiconductor manufacturing strategies.
Rohm Semiconductor is expanding its back-end chip manufacturing outsourcing in India, partnering with local OSATs while keeping wafer fabrication in-house. This strategy aims to enhance supply chain resilience and support India's localization goals, with potential implications for global semiconductor manufacturing.
Technical details
- TOLL packaging for two-wheeler applications
- TO-252 packaging for four-wheeler applications
- Power MOSFETs as initial products for outsourcing
- Solist-AI technology for on-device AI with AxICORE-ODL hardware accelerator
- Use of TSMC's GaN process technology for end-to-end production by 2027
FAQ
What is Rohm Semiconductor's strategy for back-end chip manufacturing in India?
Rohm Semiconductor is outsourcing back-end operations, including assembly and test, to Indian OSATs like Tata Electronics and Suchi Semicon, while maintaining in-house wafer fabrication.
Which packaging types are being handled by the Indian OSAT partners?
Tata Electronics is handling TOLL packaging for two-wheeler applications, while Suchi Semicon is managing TO-252 packaging for four-wheeler applications.
What are the key factors driving Rohm's expansion in India?
India's localization initiatives, supply chain resilience goals, and the potential to access local markets are key drivers for Rohm's strategy.
What technologies is Rohm developing in India?
Rohm is exploring AI technologies like Solist-AI for on-device applications and is working on GaN production for AI servers and electric vehicles.
How does Rohm plan to expand its OSAT partnerships in the future?
Rohm is evaluating the capabilities of Indian OSATs and may expand production to serve global markets, starting with existing products and local demand.
This summary and analysis were generated with AI from the original article and may contain errors. Read the original for the full story.
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Originally published by EE Times on Oct 8, 2026.
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