Stay updated with the latest developments in Artificial Intelligence
Everspin’s demo shows how a 4-GB pool of persistent MRAM can serve as a new tier of storage between DRAM and NAND flash. The post CXL-Connected MRAM Address AI Storage Latency appeared first on EE Times.
Kepler targets 2027 production for 3D ferroelectric memory promising 5–10× better bandwidth per watt than HBM. The post Kepler Aims to Launch Energy-Saving Replacement for HBM in 2027 appeared first on EE Times.
See how trusted AI combines intelligence, domain expertise, and deterministic verification to boost confidence in semiconductor design. The post Trusted AI: Why Intelligence Alone Isn’t Enough appeared first on EE Times.
Synopsys joins OpenAI for a leap of faith in AI-native IC design by augmenting frontier models with EDA tools. The post GPT-Synopsys Combines IC Design EDA with Agentic AI appeared first on EE Times.
Broader appeal for the electric car is a big challenge. Innovation is still the best solution. The post Electric Car Makers Need to Appeal to the ‘Other 90%’ appeared first on EE Times.
At AutoSens Europe, automotive sensing designs reflected tighter safety standards, advances in AI processing, and growing cybersecurity requirements. The post AutoSens 2026: Regulation Drives Automotive Sensing Architectures appeared first on EE Times.
Analog Devices India’s Praveen Jose said device miniaturization is driving higher performance and quality in smaller form factors. The post Continuous Health Monitoring Drives Integrated Wearable System Design appeared first on EE Times.
Qualcomm introduced two distinct Snapdragon 8 Elite Gen 6 SoCs for high-end smartphones as it expands personal agentic AI across mobile, wearables, and PCs. The post Qualcomm Doubles Down on Agentic AI at Snapdragon Summit 2026 appeared first on EE Times.
Join us where attendees will see how on-device processing improves resilience, reduces exposure of sensitive data, counters spoofing, and supports practical deployment across buildings, smart locks, vehicles and appliances.
Are you struggling with PCBA defects? Learn how to optimize your PCBA testing strategy by combining In-Circuit Testing (ICT), Functional Testing (FCT with Bed-of-Nails or Flying Probe Testers. The post PCBA Test Strategies: How to Select the Right Methodology and Tester appeared first on EE Times.
Instead of traditional ERP, small electronics manufacturers are finding that affordable SME-focused manufacturing software provides needed functionality. The post Small Electronics Manufacturers Save Big on ERP appeared first on EE Times.
Europe's strategic space independence will depend on semiconductor supply chains, satellite networks, and 6G communications. The post Europe’s Space Industry Seeks Greater Supply Chain Control appeared first on EE Times.
See how Emergence AI is deploying neuroformal AI with chipmakers to boost wafer yields and tackle fab, test, and packaging failures. The post Emergence AI to Deploy Neuroformal AI With Fabless Chipmakers appeared first on EE Times.
TSMC’s 3-nm node nears the revenue lead, but history shows 7 nm ramped faster; compare the data before evaluating 2 nm. The post TSMC’s 3-nm Ramp Looks Different in Historical Context appeared first on EE Times.
Join us to explore how Praziflux® is transforming brazing processes across the EV industry and other thermal management applications. The post Advanced Strategies for Heat Exchanger Manufacturing in EVs & Thermal Management Systems appeared first on EE Times.
Manufacturing intelligence connects EDA, TCAD and metrology to turn manufacturing evidence into trusted action, faster. The post Manufacturing Intelligence: Turning EDA Data into Trusted Action appeared first on EE Times.
At A*STAR’s Innovate Together 2026, industry experts explored packaging, hybrid bonding, optical interconnects, and process control for AI. The post AI Drives Larger, Denser Packaging, Raising New Challenges for Equipment Makers appeared first on EE Times.
Astera Labs pairs Leo memory controllers with Scorpio fabric switches to bring scalable memory closer to AI accelerators. The post Astera Labs’ Leo Controller Update Targets Memory Constraints appeared first on EE Times.
Showing 54 of 64 stories
Load more storiesGet the top AI news and tools straight to your inbox every week.
Weekly · AI news from EE Times
Join 15,000+ AI enthusiasts
